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News Strategy Partners Consortia Open Calls &#038; Annual Schedule AEARU APRU HeKKSaGOn MIRAI 2.0 RENKEI Overseas Office Alumni Network Access For TU Staff Lang:   English  日本語 Tohoku University joins the Japan-U.S. UPWARDS for the Future Partnership Tuesday May 23rd, 2023 International Exchange Division News, 未分類 0 The signing ceremony for the UPWARDS for the Future partnership (photographs courtesy of the U.S. Embassy in Tokyo) On May 21, the final day of the G7 Summit in Hiroshima, a signing ceremony for the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future took place in the presence of U.S. Secretary of State Antony J. Blinken and Keiko Nagaoka, the Japanese Minister for Education, Culture, Sports, Science and Technology. President Hideo Ohno signed the memorandum of understanding on behalf of the university, and he was accompanied to the ceremony by Vice President Masahiro Yamaguchi and Prof. Tetsuo Endoh, the Director of the Center for Innovative Integrated Electronic Systems. The purpose of the partnership is to develop a more robust, highly skilled semiconductor workforce and to drive research and development in both Japan and the United States. In total, eleven universities from across the U.S. and Japan joined Micron, the National Science Foundation, and Tokyo Electron as founding members. $60 million will be invested over the next five years, facilitating partners’ collaborative educational initiatives focused on cutting-edge semiconductor R&D, providing learning opportunities for students, and promoting new research activities. With respect to diversity, equity and inclusion (DEI), support will be provided for the advancement of women in the semiconductor field. Advancing innovative semiconductor R&D, manufacturing, supply chains and workforce development is seen as essential to ensure the realization of a carbon-neutral society, as well as economic growth and economic security. The collaboration between industry and the participating Japanese and American universities within this partnership is expected to drive progress toward a more sustainable world. After the ceremony, President Ohno and the other signatories met U.S. President Joe Biden, who expressed his high expectations for the partnership. UPWARDS for the Future participants (in alphabetical order): Japanese Universities: Hiroshima University, Kyushu University, Nagoya University, Tohoku University, Tokyo Institute of Technology U.S. Universities: Boise State University, Purdue University, Rensselaer Polytechnic Institute, Rochester Institute of Technology, University of Washington, Virginia Tech   L-R: Hideo Ohno (President, Tohoku University), Marlene Tromp (President, Boise State University), Toshiki Kawai (President and CEO, Tokyo Electron), Keiko Nagaoka (Japanese Minister for Education, Culture, Sports, Science and Technology), Antony J. Blinken (U.S. Secretary of State), Rahm Emanuel (U.S. Ambassador to Japan), Sanjay Mehrotra (CEO, Micron), Mung Chiang (President, Purdue University), Mitsuo Ochi (President, Hiroshima University)(Photograph courtesy of the U.S. Embassy in Tokyo)   Tohoku University President Hideo Ohno meets U.S. President Joe Biden (Photograph courtesy of the White House)   [Related information] Micron Technology Inc. Press Release Tokyo Electron Ltd. Press Release U.S. Embassy in Tokyo Press Release   For further details, please contact the Global Engagement Coordination Team. Tel: 022-217-6311 E-mail: [email protected] English 日本語 Search for: Reports of Int&#8217;l Advisory Board第1回報告書  第2回報告書For International Students News Archives News Archives Select Month May 2024 April 2024 March 2024 February 2024 January 2024 December 2023 November 2023 October 2023 September 2023 August 2023 July 2023 June 2023 May 2023 April 2023 March 2023 February 2023 January 2023 December 2022 November 2022 October 2022 September 2022 August 2022 July 2022 June 2022 May 2022 April 2022 March 2022 February 2022 January 2022 December 2021 November 2021 October 2021 September 2021 August 2021 July 2021 June 2021 May 2021 April 2021 March 2021 February 2021 January 2021 December 2020 November 2020 October 2020 September 2020 August 2020 July 2020 June 2020 May 2020 April 2020 March 2020 February 2020 January 2020 December 2019 November 2019 October 2019 September 2019 August 2019 July 2019 June 2019 May 2019 April 2019 March 2019 February 2019 January 2019 December 2018 November 2018 October 2018 September 2018 August 2018 July 2018 June 2018 May 2018 April 2018 March 2018 February 2018 January 2018 December 2017 November 2017 October 2017 September 2017 August 2017 July 2017 June 2017 May 2017 April 2017 March 2017 February 2017 January 2017 December 2016 November 2016 October 2016 September 2016 August 2016 July 2016 June 2016 May 2016 April 2016 March 2016 February 2016 January 2016 December 2015 November 2015 October 2015 September 2015 August 2015 July 2015 June 2015 May 2015 April 2015 March 2015 February 2015 January 2015 December 2014 November 2014 October 2014 September 2014 August 2014 July 2014 June 2014 May 2014 April 2014 March 2014 February 2014 December 2013 November 2013 October 2013 September 2013 August 2013 July 2013 June 2013 May 2013 April 2013 News Strategy Partners Consortia Overseas Offices TUGW Series Access Tohoku University (EN) Tohoku University (JP) Tohoku University China Office TU Administration Bureau (JP) For TU Staff Fact Book Annual Review Download Language:   English  日本語 Copyright © 2024 | WordPress Theme by MH Themes

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